MATERIALS FOR SEMICONDUCTOR MACHINE

(A) Polishing Process

This process is to polish the surface of silicon wafer. In polishing, Fluorine tube (Teflon tube) is used to apply slurry-based chemicals.

(B) Resist Coating to Etching Process

When a circuit pattern on a wafer is produced, special photosensitive materials are used. This process is divided into four stages: photoresist coating, exposure, development, and etching. Photoresist coating is the application of resist to wafer. The exposure process is photosensitive resist with light passed along circuit pattern. The development stage is to remove the photosensitive resist with a special liquid (developer). The etching process is to remove the oxide film before resist coating. A fluorine tube (Teflon tube) is usually used for getting rid of the oxide film (Resist Coating Pre-Treatment). In the resist process, polyvinyl alcohol, cinnamic acid chloride, and naphthoquinone azide are frequently used chemicals. In the development process, the aqueous solution of tetramethylammonium hydroxide, xylene, and acetate are frequently used chemicals. In the etching process, phosphoric acid (aluminum), ferric chloride (copper), hydrofluoric acid, and acetone are frequently used chemicals.

(C) Cleaning Process

In order to remove any contaminations such as wastes and metal ions on the surface of the wafer, fluids such as high-purity acid, alkali-based chemicals (such as ammonia, hydrogen peroxide, hydrochloric acid, and hydrogen peroxide), and pure water are used. A fluorine tube (Teflon tube) is used for transporting these fluids.